High-speed chip mounter
Multi-function placement machine subverted the traditional SMT process，used the vibration plate to feed,saved braiding process and feida feeding materials and time cost. High-speed mobile module group take group past,Greatly improve the production efficiency, is one of the most popular packaging manufacturer placement machine.
Features of products
For large and medium-sized size products,Such as 1.2 M fluorescent lamp, panel light, 0.5 ~ 1 M soft light, the display panel,etc;can be used with different size SMD materials: such as 2835、3014、3528、3535、5050、5730,etc.
2.The self-defined number of suction head
According to the requirements of the users of different FPC or PCB,can set customize number of suction,ensure placement machine efficiency maximization.
3.The photoelectric performance test
Adopted the test at the bottom, to ensure 100% after each lamp bead pasted on the light.
Adopt PLC control system with a high speed vibration feeder,cooperate with the transmission system of the leading level,greatly improve the speed and stability of the equipment operation.
5.Very high efficiency、ultra-high precision
The way of group taking and group pasting ensure the high efficiency of patching; fixture, mold and tailored to achieve SMT ultra-high precision.
|Chip mounter system||自主研发，独立知识产权|
|Patching speed||80K-100K CPH|
|Vibration bulk feeder||2 groups|
|Positioning way||CCD positioning|
||the maximum 1200L*320W|
|Way of component supplying||
round flat vibrationbulk automatic feed/repalceable feida feed
|Size of apprearance||1600mm x 1800mm x 1650mm|
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